Thermal Spreading and Contact Resistance
Fundamentals and Applications
Yuri S. Muzychka, M. Michael Yovanovich
- English
- ePUB (disponibile sull'app)
- Disponibile su iOS e Android
Thermal Spreading and Contact Resistance
Fundamentals and Applications
Yuri S. Muzychka, M. Michael Yovanovich
Informazioni sul libro
Thermal Spreading and Contact Resistance: Fundamentals and Applications
Single source reference on how applying thermal spreading and contact resistance can solve problems across a variety of engineering fields
Thermal Spreading and Contact Resistance: Fundamentals and Applications offers comprehensive coverage of the key information that engineers need to know to understand thermal spreading and contact resistance, including numerous predictive models for determining thermal spreading resistance and contact conductance of mechanical joints and interfaces, plus detailed examples throughout the book.
Written by two of the leading experts in the field, Thermal Spreading and Contact Resistance: Fundamentals and Applications includes information on:
- Contact conductance, mass transfer, transport from super-hydrophobic surfaces, droplet/surface phase change problems, and tribology applications such as sliding surfaces and roller bearings
- Heat transfer in micro-devices and thermal spreaders, orthotropic systems, and multi-source applications for electronics thermal management applications
- Fundamental principles, thermal spreading in isotropic half-space regions, circular flux tubes and disc spreaders, and rectangular flux channels and compound spreaders
- Systems with non-uniform sink plane conductance, transient spreading resistance, and contact resistance between both non-conforming and conforming rough surfaces
Providing comprehensive coverage of the subject, Thermal Spreading and Contact Resistance: Fundamentals and Applications is an essential resource for mechanical, aerospace, and chemical engineers working on research in the fields of heat transfer, thermal management of electronics, and tribology, as well as thermal engineers and researchers in the field of thermal physics.