1.1 Introduction
Sensors have become a ubiquitous part of today's world. Modern cars employ tens of sensors, ranging from simple position sensors to multi-axis MEMS accelerometers and gyroscopes. These sensors enhance engine performance and reliability, ensure compliance with environmental standards, and increase occupant comfort and safety. In another example, modern homes contain several sensors, ranging from simple thermostats to infrared motion sensors and thermal gas flow sensors. However, the best example of the ubiquity of sensors is probably the mobile phone, which has evolved from a simple communications device into a veritable sensor platform. A modern mobile phone will typically contain several sensors: a touch sensor, a microphone, one or two image sensors, inertial sensors, magnetic sensors, and environmental sensors for temperature, pressure and even humidity. Together with a GPS receiver for position location, these sensors greatly enhance ease of use and have extended the utility of mobile phones far beyond their original role as portable telephones.
Today, most of the sensors in a mobile phone, as well as most sensors intended for consumer applications, are made from silicon. This is mainly because silicon sensors can be mass-produced at low cost by exploiting the large manufacturing base established by the semiconductor industry. Another important motivation is the fact that the electronic circuitry required to bias a sensor and condition its output can be readily realized on the same substrate or, at least, in the same package. It also helps that semiconductor-grade silicon is a highly pure material with well-defined physical properties, some of which can be tuned by doping, and which can be precisely machined at the nanometer scale.
Silicon is a versatile material, one that exhibits a wide range of physical phenomena and so can be used to realize many different kinds of sensors [1]. For example, magnetic fields can be sensed via the Hall effect, temperature differences can be sensed via the Seebeck effect, mechanical strain can be sensed via the piezo-resistive effect and light can be sensed via the photo-electric effect. In addition, measurands that do not directly interact with silicon can often be indirectly sensed with the help of silicon-compatible materials. For example, humidity can be sensed by measuring the dielectric constant of a hygroscopic polymer [2], while gas concentration can be sensed by measuring the resistance of a suitably adsorbing metal oxide [3]. It should be noted that although silicon sensors may not achieve best-in-class performance, their utility and increasing popularity stems from their small size, low cost and the ease-of-use conferred by their co-integrated electronic circuitry.
Sensors are most useful when they are part of a larger system that is capable of processing and acting upon the information that they provide. This information must therefore be transmitted to the rest of the system in a robust and standardized manner. However, since sensors typically output weak analog signals, this task must be performed by additional electronic circuitry. Such interface electronics is best located close to the sensor, to minimize interference and avoid transmission losses. When they are both located in the same package, the combination of sensor and interface electronics is what we shall refer to as a smart sensor [4].
In addition to providing a robust signal to the outside world, the interface electronics of a smart sensor can be used to perform traditional signal processing functions such as filtering, linearization and compression. But it can also be used to increase the sensor's reliability by implementing self-test and even self-calibration functionality (as will be discussed in Chapter 2). A recent trend is towards sensor fusion, in which the outputs of multiple sensors in a package are combined to generate a more reliable output. For example, the outputs of gyroscopes, accelerometers and magnetic sensors can be combined to obtain robust position estimates, thus enabling mobile devices with indoor navigational capability.
This chapter discusses the design of smart sensor systems, in general, and the design of smart sensors in standard integrated circuit (CMOS) technology, in particular. Examples will be given of the design of state-of-the-art CMOS smart sensors for the measurement of temperature, wind velocity and magnetic field. Although the use of standard CMOS technology constrains the performance of the actual sensors, it minimizes cost, and as will...
