eBook - ePub

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Name: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
ISBN: 9781315305851

Xing-Chang Wei,

322 pages
English
ePUB (mobile friendly)
Available on iOS & Android

eBook - ePub

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Xing-Chang Wei,

About this book

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems.

This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.

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Yes, you can access Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging by Xing-Chang Wei in PDF and/or ePUB format, as well as other popular books in Informatik & Hardware. We have over one million books available in our catalogue for you to explore.