eBook - ePub

Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

Name: Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement
ISBN: 9780429680069

Yue Ma,

Christian Gontrand,

226 pages
English
ePUB (mobile friendly)
Available on iOS & Android

eBook - ePub

Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

Yue Ma,

Christian Gontrand,

About this book

As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.

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Yes, you can access Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement by Yue Ma,Christian Gontrand in PDF and/or ePUB format, as well as other popular books in Computer Science & Computer Networking. We have over one million books available in our catalogue for you to explore.