Air Cooling Technology for Electronic Equipment
eBook - ePub

Air Cooling Technology for Electronic Equipment

  1. 272 pages
  2. English
  3. ePUB (mobile friendly)
  4. Available on iOS & Android
eBook - ePub

Air Cooling Technology for Electronic Equipment

About this book

Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics. Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling? The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.

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Yes, you can access Air Cooling Technology for Electronic Equipment by Sung Jin Kim,Sang Woo Lee in PDF and/or ePUB format, as well as other popular books in Technology & Engineering & Electrical Engineering & Telecommunications. We have over one million books available in our catalogue for you to explore.

Table of contents

  1. Cover
  2. Half Title
  3. About the cover
  4. Title Page
  5. Copyright Page
  6. Foreword
  7. Preface
  8. Contributors
  9. Table of Contents
  10. Chapter 1 Geometric Optimization of Cooling Techniques
  11. Chapter 2 Entrance Design Correlations for Circuit Boards in Forced-Air Cooling
  12. Chapter 3 Forced Air Cooling of Low-Profile Package Arrays
  13. Chapter 4 Conjugate Heat Transfer in Forced Air Cooling of Electronic Components
  14. Chapter 5 Enhanced Air Cooling of Electronic Equipment
  15. Chapter 6 Limits of Air Cooling—A Methodical Approach
  16. Index