- 350 pages
- English
- PDF
- Available on iOS & Android
eBook - PDF
3D Integration for VLSI Systems
About this book
Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
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Yes, you can access 3D Integration for VLSI Systems by Chuan Seng Tan, Kuan-Neng Chen, Steven J. Koester in PDF and/or ePUB format, as well as other popular books in Physical Sciences & Biology. We have over one million books available in our catalogue for you to explore.
Information
Table of contents
- Front Cover
- Preface
- Contents
- Chapter 1: 3D Integration Technology – Introduction and Overview
- Chapter 2: A Systems Perspective on 3D Integration: What is 3D? And What is 3D Good For?
- Chapter 3: Wafer Bonding Techniques
- Chapter 4: TSV Etching
- Chapter 5: TSV Filling
- Chapter 6: 3D Technology Platform: Temporary Bonding and Release
- Chapter 7: 3D Technology Platform: Wafer Thinning, Stress Relief, and Thin Wafer Handling
- Chapter 8: Advanced Die-to-Wafer 3D Integration Platform: Self-Assembly Technology
- Chapter 9: Advanced Direct Bond Technology
- Chapter 10: Surface Modification Bonding at Low Temperature for Three-Dimensional Hetero-Integration
- Chapter 11: Through Silicon Via Implementation in CMOS Image Sensor Product
- Chapter 12: A 300-mm Wafer-Level Three-Dimensional Integration Scheme Using Tungsten Through-Silicon Via and Hybrid Cu-Adhesive Bonding
- Chapter 13: Power Delivery in 3D IC Technology with a Stratum Having an Array of Monolithic DC-DC Point-of-Load (PoL) Converter Cells
- Chapter 14: Thermal-Aware 3D IC Designs
- Chapter 15: 3D IC Design Automation Considering Dynamic Power and Thermal Integrity
- Chapter 16: Outlook
- Back Cover