Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
eBook - PDF

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

  1. 1,048 pages
  2. English
  3. PDF
  4. Available on iOS & Android
eBook - PDF

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

About this book

This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif

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Yes, you can access Handbook of Lead-Free Solder Technology for Microelectronic Assemblies by Karl J. Puttlitz,Kathleen A. Stalter in PDF and/or ePUB format, as well as other popular books in Technology & Engineering & Materials Science. We have over one million books available in our catalogue for you to explore.

Table of contents

  1. Book Cover
  2. Title
  3. Copyright
  4. Preface
  5. Contents
  6. Contributors
  7. 1 Overview of Lead-Free Solder Issues Including Selection
  8. 2 Health and Environmental Effects of Lead and Other Commonly Used Elements in Microelectronics
  9. 3 Environmental Impact of Lead and Alternatives in Electronics
  10. 4 Environmental Stewardship with Regional Perspectives and Drivers of the Lead-free Issue
  11. 5 Market, Product, and Corporate Policy Trends
  12. 6 The Metallurgical Aspects, Properties, and Applications of Solders from the Leadā€“Tin System
  13. 7 Physical Basis for Mechanical Properties of Solders
  14. 8 Snā€“Ag and Snā€“Agā€“X Solders and Properties
  15. 9 Biā€“Sn, Snā€“Sb, Snā€“Cu, Snā€“Zn, and Snā€“In Solder-Based Systems and Their Properties
  16. 10 High-Temperature Lead-Free Solders with Dispersoids
  17. 11 Solder Wetting and Spreading
  18. 12 Lead-Free Finishes for Printed Circuit Boards and Components
  19. 13 Formation of Intermetallic Compounds at Pbā€“Sn/Metal and Lead-Free/Metal Interfaces in Solder Joints
  20. 14 Electronics Assembly and the Impact of Lead-Free Materials
  21. 15 Use of Inert Atmospheres in Lead-Free Soldering
  22. 16 Pb-Free Component Conversion and Some Manufacturing Experiences
  23. 17 Major International Lead (Pb)-Free Solder Studies
  24. 18 Electrically Conductive Adhesivesā€”A Lead-Free Alternative
  25. 19 Reliability Aspects of Lead-Free Solders in Electronic Assemblies
  26. 20 The Physics and Materials Science of Electromigration and Thermomigration in Solders
  27. 21 The Structure and Kinetics of Tin-Whisker Formation and Growth on High Tin Content Finishes
  28. 22 Degradation Phenomena
  29. Index
  30. Biographies