eBook - ePub

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Name: Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
ISBN: 9780857099112

E-H Wong,

Y.-W. Mai,

482 pages
English
ePUB (mobile friendly)
Available on iOS & Android

eBook - ePub

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

E-H Wong,

Y.-W. Mai,

About this book

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.- Discusses how the reliability of packaging components is a prime concern to electronics manufacturers- Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques- Includes program files and macros for additional study

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Yes, you can access Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture by E-H Wong,Y.-W. Mai in PDF and/or ePUB format, as well as other popular books in Technology & Engineering & Electrical Engineering & Telecommunications. We have over one million books available in our catalogue for you to explore.