Reflow Soldering Processes
eBook - PDF

Reflow Soldering Processes

  1. 288 pages
  2. English
  3. PDF
  4. Available on iOS & Android
eBook - PDF

Reflow Soldering Processes

About this book

Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel.Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process, --and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable.Provides engineers the cutting-edge technology in a rapidly changing fieldOffers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process

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Yes, you can access Reflow Soldering Processes by Ning-Cheng Lee in PDF and/or ePUB format, as well as other popular books in Technology & Engineering & Industrial Design. We have over one million books available in our catalogue for you to explore.

Table of contents

  1. Front Cover
  2. Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies
  3. Copyright Page
  4. Contents
  5. Preface
  6. Chapter 1. Introduction to Surface Mount Technology
  7. Chapter 2. Fundamentals of Solders and Soldering
  8. Chapter 3. Solder Paste Technology
  9. Chapter 4. Surface Mount Assembly Processes
  10. Chapter 5. SMT Problems Prior to Reflow
  11. Chapter 6. SMT Problems During Reflow
  12. Chapter 7. SMT Problems at the Post-reflow Stage
  13. Chapter 8. Solder Bumping for Area Array Packages
  14. Chapter 9. BGA and CSP Assembly and Rework
  15. Chapter 10. Flip Chip Reflow Attachment
  16. Chapter 11. Optimizing a Reflow Profile Via Defect Mechanisms Analysis
  17. Chapter 12 Lead-free Soldering
  18. Index