Handbook of Quality Integrated Circuit Manufacturing

Robert Zorich

• Publisher: Academic Press
• Year: 2012
• Print ISBN:
  9780127818702
• eBook ISBN:
  9780323140553
• Topic: Technology & Engineering
• Subtopic: Industrial Design
• Index: Technology & Engineering

Here is a comprehensive practical guide to entire wafer fabrication process from A to Z. Written by a practicing process engineer with years of experience, this book provides a thorough introduction to the complex field of IC manufacturing, including wafer area layout and design, yield optimization, just-in-time management systems, statistical quality control, fabrication equipment and its setup, and cleanroom techniques. In addition, it contains a wealth of information on common process problems: How to detect them, how to confirm them, and how to solve them. Whether you are a new enginner or technician just entering the field, a fabrication manager looking for ways to improve quality and production, or someone who would just like to know more about IC manufacturing, this is the book you're looking for. - Provides a readable, practical overview of the entire wafer fabrication process for new engineers and those just entering this complex field - Enables engineers and managers to improve production, raise quality levels, and solve problems that commonly occur in the fabrication process - Presents the latest techniques and gives special attention to Japanese IC manufacturing techniques, showing how they obtain outstanding quality

Table of contents

• Front Cover
• Handbook of Quality Integrated Circuit Manufacturing
• Copyright Page
• Table of Contents
• Dedication
• Preface
• CHAPTER 1. OVERVIEW OF SEMICONDUCTOR MANUFACTURING
• CHAPTER 2. YIELD OPTIMIZATION
• CHAPTER 3. METHODS OF SEMICONDUCTOR ANALYSIS
• CHAPTER 4. CLEANROOM FACILITIES AND PROCEDURES
• CHAPTER 5. WAFER CLEANING TECHNIQUES
• CHAPTER 6. PHOTOLITHOGRAPHY AND ETCH PROCESSES
• CHAPTER 7. THE DIFFUSION PROCESSES
• CHAPTER 8. LOW-PRESSURE CHEMICAL VAPOR DEPOSITION PROCESSES
• CHAPTER 9. ION IMPLANTATION PROCESSES
• CHAPTER 10. METAL FILM DEPOSITION PROCESSES
• CHAPTER 11. INTEGRATED CIRCUIT TESTING AND ANALYSIS
• CHAPTER 12. STATISTICAL QUALITY CONTROL
• CHAPTER 13. THE PEOPLE WHO MAKE THE CHIPS
• CHAPTER 14. FUTURE TRENDS AND CONCLUSIONS531
• APPENDIX A: HAZARDOUS CHEMICAL TOXICITY TABLE
• APPENDIX B: EXPERIMENT DESIGN FOR PROCESS AND PRODUCT DEVELOPMENT
• BIBLIOGRAPHY
• INDEX