
Practical Guide to the Packaging of Electronics
Thermal and Mechanical Design and Analysis, Third Edition
- 342 pages
- English
- ePUB (mobile friendly)
- Available on iOS & Android
Practical Guide to the Packaging of Electronics
Thermal and Mechanical Design and Analysis, Third Edition
About this book
Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems
A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration.
Additionally, the author:
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- Addresses various cross-discipline issues in the design of electromechanical products
- Provides a solid foundation for heat transfer, vibration, and life expectancy calculations
- Identifies reliability issues and concerns
- Develops the ability to conduct a more thorough analysis for the final design
- Includes design tips and guidelines for each aspect of electronics packaging
Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition
explains the mechanical and thermal/fluid aspects of electronic product design and offers a basic understanding of electronics packaging design issues. Defining the material in-depth, it also describes system design guidelines and identifies reliability concerns for practitioners in mechanical, â electrical or quality engineering.
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Information
Table of contents
- Cover
- Half Title
- Title
- Copyright
- Dedication
- Contents
- List of Figures
- List of Tables
- Preface to the Third Edition
- Preface to the Second Edition
- Preface to the First Edition
- Acknowledgments
- Author
- 1: Introduction
- 2: Basic Heat TransferâConduction, Convection, and Radiation
- 3: Conductive Cooling
- 4: Radiation Cooling
- 5: Fundamentals of Convection Cooling
- 6: Combined Modes, Transient Heat Transfer, and Advanced Materials
- 7: Basics of Vibration and Its Isolation
- 8: Basics of Shock Management
- 9: Induced Stresses
- 10: The Finite Element Methods
- 11: Mechanical and Thermomechanical Concerns
- 12: Acoustics
- 13: Mechanical Failures and Reliability
- 14: Electrical Failures and Reliability
- 15: Chemical Attack Failures and Reliability Concerns
- 16: Reliability Models, Predictions, and Calculations
- 17: Design Considerations in an Avionics Electronic Package
- Appendix A: Description of Finite Element Model
- Appendix B: Standard Atmosphere
- Appendix C: Transient Flow Emperical Factor
- Appendix D: Impact of Convection on Spread Angle
- Appendix E: Heat Transfer Cofficients ModelsâNarrow Gap versus Wide Gap
- Appendix F: Creep
- Appendix G: Fatigue
- References
- Index