Simulation-based Investigation of Interface Delamination in Plastic IC Packages under Temperature and Moisture Loading
eBook - PDF

Simulation-based Investigation of Interface Delamination in Plastic IC Packages under Temperature and Moisture Loading

,
  1. 192 pages
  2. English
  3. PDF
  4. Available on iOS & Android
eBook - PDF

Simulation-based Investigation of Interface Delamination in Plastic IC Packages under Temperature and Moisture Loading

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Information

Publisher
Cuvillier Verlag
Year
2010
Print ISBN
9783869554334
eBook ISBN
9783736934337
Edition
1

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