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  3. Polymeric Materials for Electronics Packaging and Interconnection
Polymeric Materials for Electronics Packaging and Interconnection
eBook - PDF

Polymeric Materials for Electronics Packaging and Interconnection

JOHN H. LUPINSKI,
ROBERT S. MOORE,
John H. Lupinski,
Robert S. Moore,
Eric D. Wachsman,
Peter S. Martin,
Curtis W. Frank,
Randy W. Snyder,
Paul C. Painter,
Coralie A. Pryde,
Allyson J. Beuhler,
Neal R. Nowicki,
Joanne M. Gaudette,
A. R. Rossi,
B. D. Silverman,
Diane M. Stoakley,
Anne K. St. Clair,
D. L. Goff,
E. L. Y,
John H. Lupinski,
Robert S. Moore,
M. Joan Comstock,
John H. Lupinski,
Robert S. Moore,
M. Joan Comstock,
  1. 516 pages
  2. English
  3. PDF
  4. Available on iOS & Android
eBook - PDF

Polymeric Materials for Electronics Packaging and Interconnection

JOHN H. LUPINSKI,
ROBERT S. MOORE,
John H. Lupinski,
Robert S. Moore,
Eric D. Wachsman,
Peter S. Martin,
Curtis W. Frank,
Randy W. Snyder,
Paul C. Painter,
Coralie A. Pryde,
Allyson J. Beuhler,
Neal R. Nowicki,
Joanne M. Gaudette,
A. R. Rossi,
B. D. Silverman,
Diane M. Stoakley,
Anne K. St. Clair,
D. L. Goff,
E. L. Y,
John H. Lupinski,
Robert S. Moore,
M. Joan Comstock,
John H. Lupinski,
Robert S. Moore,
M. Joan Comstock,

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Information

Publisher
American Chemical Society
Year
1989
Print ISBN
9780841212633
eBook ISBN
9780841212633

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