Polymeric Materials for Electronic Packaging
eBook - ePub

Polymeric Materials for Electronic Packaging

  1. English
  2. ePUB (mobile friendly)
  3. Available on iOS & Android
eBook - ePub

Polymeric Materials for Electronic Packaging

About this book

POLYMERIC MATERIALS FOR ELECTRONIC PACKAGING

Create and deploy reliable polymeric materials for use in electronic products with this comprehensive guide

Modern electronic products are manufactured at a finer scale and with more precision than ever before. This places increasing demand on the proper use and management of high-performance polymers to create reliable, rapidly-operating semiconductor products. Understanding the physical properties and viscoelasticity analysis of resins is essential for engineers and researchers to perfect and deploy these polymers in electronics contexts.

Polymeric Materials for Electronic Packaging is designed to meet this specific need with a thorough introduction to these materials and their production. It provides the tools engineers need to reduce processing times and increase durability in their semiconductor packages and products. Translated from the Japanese original and offering in-depth analysis from a global-leading expert, this promises to be an indispensable volume.

Polymeric Materials for Electronic Packaging readers will also find:

  • Detailed treatment of subjects including viscoelastic theory, design issues of LSI packages, and more
  • Analysis uniquely suited to the dimensions of cutting-edge semiconductor technology
  • Incorporation of cutting-edge viscoelasticity analysis software, available separately from the author

Polymeric Materials for Electronic Packaging is critical for electrical and electronics engineers working with semiconductors, as well as advanced postgraduate students and researchers in this or numerous related areas.

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Yes, you can access Polymeric Materials for Electronic Packaging by Shozo Nakamura in PDF and/or ePUB format, as well as other popular books in Technology & Engineering & Materials Science. We have over one million books available in our catalogue for you to explore.

Table of contents

  1. Cover
  2. Table of Contents
  3. Series Page
  4. Title Page
  5. Copyright Page
  6. About the Author
  7. Preface
  8. 1 Basics of Semiconductor
  9. 2 Basics of Polymer Materials
  10. 3 Basics of Elastic Theory
  11. 4 Stress Evaluations with Defects
  12. 5 Basics of Viscoelasticity
  13. 6 Measurement of Viscoelastic Properties
  14. 7 Design Issues of LSI Packages
  15. 8 Validity of Viscoelastic Analysis
  16. 9 Application to CSP‐μBGA
  17. 10 Thermal Stress and Warpage Behavior During Cooling Process of Three‐Layer Laminate
  18. 11 Warp Deformation Behavior From Heating to Cooling
  19. 12 Deformation Prediction Method Considering Curing Shrinkage of Resin
  20. 13 Changes in Material Properties and Deformation Behavior Due to Thermal Degradation
  21. 14 Simple Evaluation Method for Deformation of Viscoelastic Body
  22. 15 Effect of Cooling Rate on Warpage Behavior of Laminates
  23. Appendix A: Development of Viscoelastic Analysis Software (VESAP)
  24. Bibliography
  25. Index
  26. End User License Agreement