
- English
- PDF
- Available on iOS & Android
LCP for Microwave Packages and Modules
About this book
A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP), giving you everything you need to know to get up-to-speed on the subject. This text describes successful design and development techniques for high-performance microwave and millimeter-wave packages and modules in an organic platform. These were specifically developed to make the most of LCP's inert, hermetic, low-cost, high-frequency (DC to 110+ GHz) properties. First-hand accounts show you how to avoid various pitfalls during design and development. You'll get extensive electrical design details in areas of broadband circuit design for low-loss interconnects, couplers, splitters/combiners, baluns, phase shifters, time-delay units (TDU), power amplifier (PA) modules, receiver modules, phased-array antennas, flexible electronics, surface mounted packages, Microelectromechanical Systems (MEMS) and reliability. Ideal for engineers in the fields of RF, microwave, signal integrity, advanced packaging, material science, optical and biomedical engineering.
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Information
Table of contents
- Cover
- LCP for Microwave Packages and Modules
- Series
- Title
- Copyright
- Contents
- Preface
- 1: Introduction to electronic package engineering
- 2: Characteristics of liquid crystal polymer (LCP)
- 3: Fabrication techniques for processing LCP
- 4: LCP for wafer-level chip-scale MEMS
- 5: LCP for surface mount interconnects, packages, and modules
- 6: LCP for passive components
- 7: LCP for system design
- 8: LCP reliability
- Abbreviations, acronyms, and symbols
- Index