Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.

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Yes, you can access Electromigration in Metals by Paul S. Ho,Chao-Kun Hu,Martin Gall,Valeriy Sukharev in PDF and/or ePUB format, as well as other popular books in Technology & Engineering & Materials Science. We have over one million books available in our catalogue for you to explore.

Information

Publisher

Cambridge University Press

Year

2022

Print ISBN

9781107032385

eBook ISBN

9781009287791

Topic

Technology & Engineering

Subtopic

Materials Science

Index

Technology & Engineering

Cover
Half-title
Title Page
Copyright Information
Dedication
Contents
Preface
1 Introduction to Electromigration
2 Fundamentals of Electromigration
3 Thermal Stress Characteristics and Stress-Induced Void Formation in Aluminum and Copper Interconnects
4 Stress Evolution and Damage Formation in Confined Metal Lines under Electric Stressing: 1D Analysis
5 Electromigration in Cu Interconnect Structures
6 Scaling Effects on Microstructure of Cu and Co Nanointerconnects
7 Analysis of Electromigration-Induced Stress Evolution and Voiding in Cu Damascene Lines with Microstructure
8 Massive-Scale Statistical Studies for Electromigration
9 Assessment of Electromigration Damage in Large On-Chip Power Grids
Index

About this book

Frequently asked questions

Information

Table of contents