Direct Copper Interconnection for Advanced Semiconductor Technology
eBook - ePub

Direct Copper Interconnection for Advanced Semiconductor Technology

  1. 462 pages
  2. English
  3. ePUB (mobile friendly)
  4. Available on iOS & Android
eBook - ePub

Direct Copper Interconnection for Advanced Semiconductor Technology

About this book

In the "More than Moore" era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come.

This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book.

The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.

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Yes, you can access Direct Copper Interconnection for Advanced Semiconductor Technology by Dongkai Shangguan in PDF and/or ePUB format, as well as other popular books in Technology & Engineering & Electrical Engineering & Telecommunications. We have over one million books available in our catalogue for you to explore.

Table of contents

  1. Cover Page
  2. Half-Title Page
  3. Title Page
  4. Copyright Page
  5. Contents
  6. Preface
  7. Acknowledgments
  8. Editor
  9. Contributors
  10. Chapter 1 Advanced Packaging Landscape for Heterogeneous Integration
  11. Chapter 2 Direct Copper Interconnection for Die/Wafer Bonding: Overview
  12. Chapter 3 Hybrid Bonding Process Technology
  13. Chapter 4 Materials for Hybrid Bonding
  14. Chapter 5 Copper Electrodeposition for Advanced Packaging and Hybrid Bonding
  15. Chapter 6 Planarization for Advanced Packaging and Hybrid Bonding
  16. Chapter 7 Permanent and Temporary Wafer Bonding
  17. Chapter 8 Die-to-Wafer Hybrid Bonding for Direct Copper Interconnections
  18. Chapter 9 Design for Hybrid Bonding and Chiplets
  19. Chapter 10 Thermal Modeling and Simulation for Advanced 3DIC Systems
  20. Chapter 11 Characterization, Modeling, and Reliability for Direct Copper Interconnection
  21. Chapter 12 Applications of Hybrid Bonding and Chiplets for Heterogeneous Integration
  22. Index