Advances in Chemical Mechanical Planarization (CMP)
eBook - ePub

Advances in Chemical Mechanical Planarization (CMP)

  1. 648 pages
  2. English
  3. ePUB (mobile friendly)
  4. Available on iOS & Android
eBook - ePub

Advances in Chemical Mechanical Planarization (CMP)

About this book

Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. - Reviews the most relevant techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for current and emerging materials - Addresses consumables and process control for improved CMP, including post-CMP

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Yes, you can access Advances in Chemical Mechanical Planarization (CMP) by Babu Suryadevara in PDF and/or ePUB format, as well as other popular books in Technology & Engineering & Civil Engineering. We have over one million books available in our catalogue for you to explore.

Table of contents

  1. Advances in Chemical Mechanical Planarization (CMP)
  2. Cover
  3. Title
  4. Title Page
  5. Copyright
  6. Table of Contents
  7. Contributors
  8. Preface
  9. 1 Chemical and physical mechanisms of dielectric chemical mechanical polishing (CMP)
  10. 2 Copper chemical mechanical planarization (Cu CMP) challenges in 22 nm back-end-of-line (BEOL) and beyond
  11. 3 Electrochemical techniques and their applications for CMP of metal films
  12. 4 Ultra-low-k materials and chemical mechanical planarization (CMP)
  13. 5 CMP processing of high mobility channel materials: alternatives to Si
  14. 6 Multiscale modeling of chemical mechanical planarization (CMP)
  15. 7 Polishing of SiC films
  16. 8 Chemical and physical mechanisms of CMP of gallium nitride
  17. 9 Abrasive-free and ultra-low abrasive chemical mechanical polishing (CMP) processes
  18. 10 Transient copper removal rate phenomena with implications for polishing mechanisms
  19. 11 Environmental aspects of planarization processes
  20. 12 Preparation and characterization of slurry for CMP
  21. 13 Chemical metrology methods for CMP quality
  22. 14 Diamond disc pad conditioning in chemical mechanical polishing
  23. 15 Characterization of surface processes during oxide CMP by in situ FTIR spectroscopy
  24. 16 Chemical mechanical polishing (CMP) removal rate uniformity and role of carrier parameters
  25. 17 Approaches to defect characterization, mitigation and reduction
  26. 18 Challenges and solutions for post-CMP cleaning at device and interconnect levels
  27. 19 Applications of chemical mechanical planarization (CMP) to More than Moore devices
  28. 20 CMP for phase change materials
  29. 21 CMP pads and their performance
  30. 22 Latest developments in the understanding of PVA brush related issues during post CMP (pCMP) cleaning
  31. Index