Materials for Electronics Security and Assurance

Navid Asadizanjani, Chengjie Xi, Mark M. Tehranipoor, Mark Tehranipoor

• Publisher: Elsevier
• Year: 2024
• Print ISBN:
  9780443185427
• eBook ISBN:
  9780443185434
• Topic: Technology & Engineering
• Subtopic: Electromagnetism
• Index: Technology & Engineering

Materials for Electronics Security and Assurance reviews the properties of materials that could enable devices that are resistant to tampering and manipulation. The book discusses recent advances in materials synthesis and characterization techniques for security applications. Topics addressed include anti-reverse engineering, detection, prevention, track and trace, fingerprinting, obfuscation, and how materials could enable these security solutions. The book introduces opportunities and challenges and provides a clear direction of the requirements for material-based solutions to address electronics security challenges. It is suitable for materials scientists and engineers who seek to enable future research directions, current computer and hardware security engineers who want to enable materials selection, and as a way to inspire cross-collaboration between both communities. - Discusses materials as enablers to provide electronics assurance, counterfeit detection/protection, and fingerprinting - Provides an overview of benefits and challenges of materials-based security solutions to inspire future materials research directions - Includes an introduction to material perspectives on hardware security to enable cross collaboration between materials, design, and testing

Table of contents

• Cover
• Front Matter
• Table of Contents
• Copyright
• Contents
• About the authors
• Preface
• Acknowledgment
• List of Illustrations
• List of Tables
• Chapter 1 : Material for heterogeneous integration: Challenges and opportunities
• Chapter 2 : Packaging encapsulant material for hardware assurance
• Chapter 3 : Packaging encapsulant material characterization for counterfeit IC detection
• Chapter 4 : THz for semiconductor assurance
• Chapter 5 : Scanning acoustic microscopy package fingerprint extraction for integrated circuit hardware assurance
• Chapter 6 : Texture analysis of encapsulant packaging materials
• Chapter 7 : MEMS devices in HI packaging
• Chapter 8 : Tracking and tracing methods for hardware assurance
• Chapter 9 : Sample preparation for hardware assurance
• Chapter 10 : Silicon photonic packaging: Complexity and challenges for assurance
• Chapter 11 : Advanced IC packaging design for material inspection
• Chapter 12 : Electron beam probing for advanced IC packaging assurance
• Index
• A