TSV 3D RF Integration
eBook - ePub

TSV 3D RF Integration

High Resistivity Si Interposer Technology

  1. 292 pages
  2. English
  3. ePUB (mobile friendly)
  4. Available on iOS & Android
eBook - ePub

TSV 3D RF Integration

High Resistivity Si Interposer Technology

About this book

TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology. - Provides a detailed demonstration of the design and process development of HR-Si (High-Resistivity Silicon) interposer technology - Presents a series of implementation case studies that detail modeling and simulation, integration, qualification and testing methods - Offers a systematic and comparative literature review of HR-Si interposer technology by topic - Offers solutions to problems with TSV (through silicon via) interposer technology, including high frequency loss and cooling problems - Gives a systematic and accessible accounting on this leading technology

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Yes, you can access TSV 3D RF Integration by Shenglin Ma,Yufeng Jin in PDF and/or ePUB format, as well as other popular books in Technology & Engineering & Materials Science. We have over one million books available in our catalogue for you to explore.

Table of contents

  1. Cover
  2. Front Matter
  3. Table of Contents
  4. Copyright
  5. About the authors
  6. Preface by Yufeng Jin
  7. Preface by Shenglin Ma
  8. Acknowledgments
  9. List of Illustrations
  10. List of Tables
  11. Chapter 1 : Introduction to HR-Si interposer technology
  12. Chapter 2 : Design, process, and electrical verification of HR-Si interposer for 3D heterogeneous RF integration
  13. Chapter 3 : Design, verification, and optimization of novel 3D RF TSV based on HR-Si interposer
  14. Chapter 4 : HR-Si TSV integrated inductor
  15. Chapter 5 : Verification of 2.5D/3D heterogeneous RF integration of HR-Si interposer
  16. Chapter 6 : HR-Si interposer embedded microchannel
  17. Chapter 7 : Patch antenna in stacked HR-Si interposers
  18. Chapter 8 : Through glass via technology
  19. Chapter 9 : Conclusion and outlook
  20. Appendix 1 : Abbreviations
  21. Appendix 2 : Nomenclature
  22. Appendix 3 : Conversion factors
  23. Index
  24. A