eBook - PDF

Advanced Organics for Electronic Substrates and Packages

Name: Advanced Organics for Electronic Substrates and Packages
ISBN: 9781483165615

Andrew E Fletcher,

230 pages
English
PDF
Available on iOS & Android

eBook - PDF

Advanced Organics for Electronic Substrates and Packages

Andrew E Fletcher,

About this book

Advanced Organics for Electronic Substrates and Packages provides information on packaging, which is one of the most technologically intensive activities in the electronics industry. The electronics packaging community has realized that while semiconductor devices continue to be improved upon for performance, cost, and reliability, it is the interconnection or packaging of these devices that will limit the performance of the systems. Technology must develop packaging for transistor chips, with high levels of performance and integration providing cooling, power, and interconnection, and yet preserve the performance of the semiconductors with minimum package delay to the system. Trends in each of the major packaging technologies include chip level connection, providing the required connections between the chip and the semiconductor package. The power distribution to the chip and heat removal from the chip; first level packages providing all the necessary wiring; interconnections and power distribution; first-to-second level interconnections; and second level packages providing all the necessary wiring, connections, power distribution, and power supply connection are included as well. This book is a useful and informative reference to students or individuals studying or conducting research within the field of electronic engineering.

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Yes, you can access Advanced Organics for Electronic Substrates and Packages by Andrew E Fletcher in PDF and/or ePUB format, as well as other popular books in Physical Sciences & Physics. We have over one million books available in our catalogue for you to explore.