Practical Guide for the Reliable Packaging of Electronics
Thermal and Mechanical Design and Analysis
- English
- ePUB (mobile friendly)
- Available on iOS & Android
Practical Guide for the Reliable Packaging of Electronics
Thermal and Mechanical Design and Analysis
About this book
A definitive guide for both newcomers to the field and those in need of a refresher, the fourth edition of Practical Guide to the Reliable Packaging of Electronics provides a comprehensive understanding of the thermal and mechanical aspects of electromechanical system design, along with insights into potential failures. This edition equips design engineers with the tools to assess their work in the early stages of development, helping them identify and address weak points before they lead to system failures.
As the demand for integrating more electronic capabilities into smaller packages continues to rise, product developers and manufacturers must carefully consider how module placement and component selection impact performance. This updated edition features expanded content, including advancements in cooling technologies and materials, guidance on vibration isolation and design challenges, deeper insights into system and subsystem reliability, robust test method development, and a newly added section on applying Six Sigma DMAIC methodology for thermal and mechanical failure analysis.
By consulting this essential resource, engineers, program managers, and quality assurance professionals involved in electromechanical systems will gain a solid foundation in electronics packaging. Readers will learn to establish design guidelines, recognize potential reliability issues, and perform more thorough analyses, ultimately leading to more reliable and efficient system designs.
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Information
Table of contents
- Cover
- Half-Title Page
- Title Page
- Copyright Page
- Dedication
- Table of Contents
- Preface
- About the Author
- 1 Issues in Electronics Packaging Design
- 2 Basic Heat Transfer: Conduction, Convection, and Radiation
- 3 Conductive Cooling
- 4 Radiation Cooling
- 5 Fundamentals of Convection Cooling
- 6 Combined Modes, Transient Heat Transfer, and Advanced Materials
- 7 Basics of Vibration and Its Isolation
- 8 Basics of Shock Management
- 9 Induced Stresses
- 10 Error Proofing Measurements
- 11 Mechanical and Thermomechanical Concerns
- 12 Acoustics
- 13 Mechanical Failures and Reliability
- 14 Electrical Failures and Reliability
- 15 Chemical Attack Failures and Reliability Concerns
- 16 Reliability Models, Predictions, and Calculations
- 17 Design Considerations in an Avionics Electronic Package
- Appendix A: Description of Finite Element Model
- Appendix B: Standard Atmosphere
- Appendix C: Transient Flow Empirical Factor
- Appendix D: Impact of Convection on Spread Angle
- Appendix E: Heat Transfer Coefficient Models
- Appendix F: Creep
- Appendix G: Fatigue
- References
- Index