MEMS and Nanotechnology, Volume 4

Proceedings of the 2011 Annual Conference on Experimental and Applied Mechanics

Tom Proulx

• Publisher: River Publishers
• Year: 2025
• eBook ISBN:
  9781040602096
• Topic: Technology & Engineering
• Index: Technology & Engineering

MEMS and Nanotechnology, Volume 4 represents one of eight volumes of technical papers presented at the Society for Experimental Mechanics Annual Conference on Experimental and Applied Mechanics, held at Uncasville, Connecticut, June 13-16, 2011. The full set of proceedings also includes volumes on Dynamic Behavior of Materials, Mechanics of Biological Systems and Materials, Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials; Optical Measurements, Modeling and, Metrology; Experimental and Applied Mechanics, Thermomechanics and Infra-Red Imaging, and Engineering Applications of Residual Stress.

Table of contents

• Cover
• Series Page
• Title Page
• Copyright Page
• Preface
• Contents
• Integrated process feasibility of hard-mask for tight pitch interconnects fabrication
• Thermoelectric Effects in Current Induced Crystallization of Silicon Microstructures
• Evaluation of Resistance Measurement Techniques in Carbon Black and Carbon Nano-tubes Reinforced Epoxy
• A nano-tensile tester for creep studies
• The Measurement of Cyclic Creep Behavior in Copper Thin Film Using Microtensile Testing
• New Insight into Pile-up in Thin Film Indentation
• Measuring Substrate-Independent Young’s Modulus of Thin Films
• Analysis of Spherical Indentation of an Elastic Bilayer Using a Modified Perturbation Approach
• Nano-indentation Studies of Polyglactin 910 Monofilament Sutures
• Analytical approach for the determination of nanomechanical properties for metals
• Advances in Thin Film Indentation
• Cyclic Nanoindentation Shakedown Of Muscovite And Its Elastic Modulus Measurement
• Assessment of Digital Holography for 3D-Shape Measurement of Micro Deep Drawing Parts in comparison to Confocal Microscopy
• Full-Field Bulge Testing Using Global Digital Image Correlation: Paper number 206
• Experimental Investigation of Deformation Mechanisms Present in UltrafineGrained Metals
• Characterization of a Variation on AFIT’s Tunable MEMS Cantilever Array Metamaterial
• MEMS for real-time infrared imaging
• New Insights into Enhancing Microcantilever MEMS Sensors
• Miniature MRI-Compatible Fiber-optic Force Sensor Utilizing Fabry-Perot Interferometer
• Micromechanical Structure With Stable Linear Positive And Negative Stiffness
• Terahertz Metamaterial Structures Fabricated By Polymumps
• Investigations Into 1D and 2D Metamaterials at Infrared Wavelengths
• MEMS integrated metamaterials with variable resonance operating at RF frequencies
• Creep measurements in free-standing thin metal film micro-cantilever bending
• MEMS Reliability for Space Applications by Elimination of Potential Failure Modes through Analysis
• Analysis and Evaluation Methods Associated with the Application of Compliant Thermal Interface Materials in Multi-chip Electronic Board Assemblies
• Hierarchical Reliability Model for Life Prediction of Actively Cooled LED-Based Luminaire
• Direct Determination of Interfacial Traction-Separation Relations in Chip-Package Systems