Every transistor specification is the consequence of a band diagram. This book makes that chain explicit, from crystal physics to the packaged chip.
You will build carrier statistics and transport from band structure, derive junction behavior and breakdown, and follow minority carriers through a bipolar transistor before constructing the metal-oxide-semiconductor capacitor that underlies everything modern. Transistor chapters carry you from long-channel current equations to subthreshold slope, drain-induced barrier lowering and the leakage that ended simple scaling, then into high-permittivity gate stacks, strain, fin and nanosheet devices. Memory, power and optoelectronic chapters widen the scope. Fabrication chapters connect the physics to lithography, etch, implantation and deposition, and closing chapters cover interconnect delay, advanced packaging, compact models, yield and reliability.
Written for electrical engineering students, device and process engineers, and semiconductor professionals, this book bridges the gap between abstract physics and practical chip design. Each chapter builds on the previous one, ensuring a coherent progression from fundamental principles to advanced topics. Whether you are new to the field or seeking to deepen your expertise, this text provides the rigorous foundation needed to understand and innovate in modern semiconductor technology.
What you will learn:
• How energy bands and carrier statistics govern semiconductor behavior
• The mechanisms of doping, drift, diffusion, and carrier transport
• Generation, recombination, and the role of excess carriers
• PN junction operation, including depletion, bias, and breakdown
• Metal-semiconductor contacts and heterojunctions
• Bipolar junction transistor physics and minority carrier action
• MOS capacitor behavior and threshold voltage determination
• MOSFET current-voltage characteristics and short-channel effects
• Modern device structures: high-permittivity gates, FinFET, and nanosheet
• Fabrication processes: lithography, etch, implant, and deposition
• Interconnect, packaging, compact models, yield, and reliability
This book is ideal for electrical engineering students at the advanced undergraduate or graduate level, device and process engineers in the semiconductor industry, and professionals seeking a comprehensive reference on semiconductor device fundamentals. It assumes a basic background in physics and calculus, but builds all necessary concepts from the ground up.