eBook - PDF

High Performance Design Automation For Multi-chip Modules And Packages

Name: High Performance Design Automation For Multi-chip Modules And Packages
ISBN: 9789812830852

Jun Dong Cho,

Paul D Franzon,

264 pages
English
PDF
Available on iOS & Android

eBook - PDF

High Performance Design Automation For Multi-chip Modules And Packages

Jun Dong Cho,

Paul D Franzon,

About this book

Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.

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Yes, you can access High Performance Design Automation For Multi-chip Modules And Packages by Jun Dong Cho, Paul D Franzon in PDF and/or ePUB format, as well as other popular books in Informatica & Informatica generale. We have over one million books available in our catalogue for you to explore.