SiP System-in-Package Design and Simulation
eBook - ePub

SiP System-in-Package Design and Simulation

Mentor EE Flow Advanced Design Guide

  1. English
  2. ePUB (mobile friendly)
  3. Available on iOS & Android
eBook - ePub

SiP System-in-Package Design and Simulation

Mentor EE Flow Advanced Design Guide

About this book

An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow

Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture.

Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including:

  • Cavity and sacked dies design
  • FlipChip and RDL design
  • Routing and coppering
  • 3D Real-Time DRC check
  • SiP simulation technology
  • Mentor SiP Design and Simulation Platform

Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.

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Table of contents

  1. Cover
  2. Title Page
  3. Copyright
  4. Table of Contents
  5. About the Author
  6. Preface
  7. Chapter 1: SiP Design and Simulation Platform
  8. Chapter 2: Introduction to Package
  9. Chapter 3: The SiP Production Process
  10. Chapter 4: New Package Technologies
  11. Chapter 5: SiP Design and Simulation Flow
  12. Chapter 6: Central Library
  13. Chapter 7: Schematic Input
  14. Chapter 8: Multi-board Project Management and Concurrent Schematic Design
  15. Chapter 9: Layout Creation and Setting
  16. Chapter 10: Constraint Rules Management
  17. Chapter 11: Wire Bond Design
  18. Chapter 12: Cavity and Chip Stack Design
  19. Chapter 13: Flip Chip and RDL Design
  20. Chapter 14: Route and Plane
  21. Chapter 15: Embedded Passives Design
  22. Chapter 16: RF Circuit Design
  23. Chapter 17: Concurrent Layout Design
  24. Chapter 18: 3D Real-time DRC
  25. Chapter 19: Design Review
  26. Chapter 20: Manufacturing Data Output
  27. Chapter 21: SiP Simulation Technology
  28. Reference Materials
  29. Postscript and Thanks
  30. Index
  31. End User License Agreement

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Yes, you can access SiP System-in-Package Design and Simulation by Suny Li (Li Yang) in PDF and/or ePUB format, as well as other popular books in Technology & Engineering & Electrical Engineering & Telecommunications. We have over one million books available in our catalogue for you to explore.