Thermal Management Materials for Electronic Packaging
Preparation, Characterization, and Devices
Xingyou Tian, Xingyou Tian
- English
- ePUB (adapté aux mobiles)
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Thermal Management Materials for Electronic Packaging
Preparation, Characterization, and Devices
Xingyou Tian, Xingyou Tian
Ă propos de ce livre
Thermal Management Materials for Electronic Packaging
Practical resource exploring the theoretical and experimental basis as well as solutions for the development of new thermal management materials for electronic packaging
Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices provides in-depth and systematic summaries on cutting-edge thermal management materials for high-power density electronic devices, introducing the preparation methods and application scenarios of thermal management materials for electronic packing, covering refinements of thermal conductivity theory and performance prediction models for multiphase composites, and overall focusing on key scientific issues related to the subject, such as the internal interface of new high thermal conductive substrate materials and the mechanism of spatial topology on performance.
The text also discusses key issues on the design and preparation of thermal conductive substrate materials with high thermal conductive properties, including their characterization, properties, and manipulation, as well as the latest methods, techniques, and applications in this rapidly developing area.
Sample topics covered in Thermal Management Materials for Electronic Packaging include:
- Basic concepts and laws of thermal conduction, heat conduction differential equation and finite solution, and thermal conductivity of solids
- Definition and classification of electronic packaging, thermal management in electronic equipment, and requirements of electronic packaging materials
- Synthesis and surface modification of high thermal conductive filler and the synthesis of substrates and preparation of thermal conductive composites with inorganic ceramic skeleton structure
- Assembly of thermal conductive materials in different dimensions and preparation of composite materials, and reliability analysis and environmental performance evaluation
Thermal Management Materials for Electronic Packaging serves as an ideal reference for researchers and workers in related fields to significantly improve the mechanical and thermal management properties of materials, expand the material selection and design margin of substrates, and develop substrates that meet the application needs of different gradients.