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Introduction to Microfabrication
About this book
This accessible text is now fully revised and updated, providing an overview of fabrication technologies and materials needed to realize modern microdevices. It demonstrates how common microfabrication principles can be applied in different applications, to create devices ranging from nanometer probe tips to meter scale solar cells, and a host of microelectronic, mechanical, optical and fluidic devices in between. Latest developments in wafer engineering, patterning, thin films, surface preparation and bonding are covered.
This second edition includes:
- expanded sections on MEMS and microfluidics related fabrication issues
- new chapters on polymer and glass microprocessing, as well as serial processing techniques
- 200 completely new and 200 modified figures
- more coverage of imprinting techniques, process integration and economics of microfabrication
- 300 homework exercises including conceptual thinking assignments, order of magnitude estimates, standard calculations, and device design and process analysis problems
- solutions to homework problems on the complementary website, as well as PDF slides of the figures and tables within the book
With clear sections separating basic principles from more advanced material, this is a valuable textbook for senior undergraduate and beginning graduate students wanting to understand the fundamentals of microfabrication. The book also serves as a handy desk reference for practicing electrical engineers, materials scientists, chemists and physicists alike.
www.wiley.com/go/Franssila_Micro2e
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Information
Table of contents
- Cover
- Title Page
- Copyright
- Preface to the First Edition
- Preface to the Second Edition
- Acknowledgements
- Chapter 1: Introduction
- Chapter 2: Micrometrology and Materials Characterization
- Chapter 3: Simulation of Microfabrication Processes
- Chapter 4: Silicon
- Chapter 5: Thin-Film Materials and Processes
- Chapter 6: Epitaxy
- Chapter 7: Advanced Thin Films
- Chapter 8: Pattern Generation
- Chapter 9: Optical Lithography
- Chapter 10: Advanced Lithography
- Chapter 11: Etching
- Chapter 12: Wafer Cleaning and Surface Preparation
- Chapter 13: Thermal Oxidation
- Chapter 14: Diffusion
- Chapter 15: Ion Implantation
- Chapter 16: CMP: ChemicalāMechanical Polishing
- Chapter 17: Bonding
- Chapter 18: Polymer Microprocessing
- Chapter 19: Glass Microprocessing
- Chapter 20: Anisotropic Wet Etching
- Chapter 21: Deep Reactive Ion Etching
- Chapter 22: Wafer Engineering
- Chapter 23: Special Processes and Materials
- Chapter 24: Serial Microprocessing
- Chapter 25: Process Integration
- Chapter 26: MOS Transistor Fabrication
- Chapter 27: Bipolar Transistors
- Chapter 28: Multilevel Metallization
- Chapter 29: Surface Micromachining
- Chapter 30: MEMS Process Integration
- Chapter 31: Process Equipment
- Chapter 32: Equipment for Hot Processes
- Chapter 33: Vacuum and Plasmas
- Chapter 34: CVD and Epitaxy Equipment
- Chapter 35: Cleanrooms
- Chapter 36: Yield and Reliability
- Chapter 37: Economics of Microfabrication
- Chapter 38: Moore's Law and Scaling Trends
- Chapter 39: Microfabrication at Large
- Appendix A: Properties of Silicon
- Appendix B: Constants and Conversion Factors
- Appendix C: Oxide and Nitride Thickness by Color
- Index