
Modern Electroplating
- English
- ePUB (mobile friendly)
- Available on iOS & Android
Modern Electroplating
About this book
The definitive resource for electroplating, now completely up to date
With advances in information-age technologies, the field of electroplating has seen dramatic growth in the decade since the previous edition of Modern Electroplating was published. This expanded new edition addresses these developments, providing a comprehensive, one-stop reference to the latest methods and applications of electroplating of metals, alloys, semiconductors, and conductive polymers.
With special emphasis on electroplating and electrochemical plating in nanotechnologies, data storage, and medical applications, the Fifth Edition boasts vast amounts of new and revised material, unmatched in breadth and depth by any other book on the subject. It includes:
- Easily accessible, self-contained contributions by over thirty experts
- Five completely new chapters and hundreds of additional pages
- A cutting-edge look at applications in nanoelectronics
- Coverage of the formation of nanoclusters and quantum dots using scanning tunneling microscopy (STM)
- An important discussion of the physical properties of metal thin films
- Chapters devoted to methods, tools, control, and environmental issues
- And much more
A must-have for anyone in electroplating, including technicians, platers, plating researchers, and metal finishers, Modern Electroplating, Fifth Edition is also an excellent reference for electrical engineers and researchers in the automotive, data storage, and medical industries.
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Information
Table of contents
- Cover
- Title Page
- Copyright
- Preface
- Preface to the Fourth Edition
- Acknowledgements
- Conversion Factors
- Graphical Conversions
- The Electrochemical Society Series
- Chapter 1: Fundamental Considerations
- Chapter 2: Electrodeposition of Copper
- Chapter 3: Electrodeposition of Nickel
- Chapter 4: Electrodeposition of Gold
- Chapter 5: Electroless and Electrodeposition of Silver
- Chapter 6: Tin and Tin Alloys for Lead-Free Solder
- Chapter 7: Electrodeposition of Chromium
- Chapter 8: Electrodeposition of Lead and Lead Alloys
- Chapter 9: Electrodeposition of Tin–Lead Alloys
- Chapter 10: Electrodeposition of Zinc and Zinc Alloys
- Chapter 11: Electrodeposition of Iron and Iron Alloys
- Chapter 12: Palladium Electroplating
- Chapter 13: Electrochemical Deposition Process for ULSI Interconnection Devices
- Chapter 14: Electrodeposition of Semiconductors
- Chapter 15: Deposition on Nonconductors
- Chapter 16: Conductive Polymers: Electroplating of Organic Films
- Chapter 17: Electroless Deposition of Copper
- Chapter 18: Electroless Deposition of Nickel
- Chapter 19: Electrochemical Synthesis of Metal Alloys for Magnetic Recording Systems
- Chapter 20: Electroless Deposition of Palladium and Platinum
- Chapter 21: Electroless Deposition of Gold
- Chapter 22: Electroless Deposition of Alloys
- Chapter 23: Preparation for Deposition
- Chapter 24: Manufacturing Tools
- Chapter 25: Monitoring and Control
- Chapter 26: Environmental Aspects of Electrodeposition
- Chapter 27: Applications to Magnetic Recording and Microelectronic Technologies
- Chapter 28: Microelectromechanical Systems
- Chapter 29: Analysis of Electroplated Films Using Dual-Beam FIB/SEM and TEM Techniques
- Chapter 30: Ionic Liquid Treatments for Enhanced Corrosion Resistance of Magnesium-Based Substrates
- Appendix 30A: Chemical Conversion, Electro- and Electroless Deposition Bath Formulae
- Appendix
- Index